Rework Solder Fountain, - HT Lead Free* Model

For placement or removal of thru-hole components from PC boards, such as connectors, DIPs, PGAs, sockets, etc. For solder pots or solder dipping machines click here.

Mini-wave     Blow-off  
 GW - 10 Nozzles       Board Fixture

GW-10-HT Model: for RoHS compliant soldering
For Automated Selective Soldering click here

Specifications:

Power

120 VAC, 60 Hz, 15 A
optional 220 VAC, 50/60 Hz, 8 A

Max solder temp

300°C, (Model GW-10-HT: 350°C)

Solder capacity

50 lbs (23Kg)

Compressed Air (GW-10A only)

60 PSI (4 bar)

Dimensions

16"x26"x17" (406x660x432 mm)

Warm-up time

Approx. 30-45 min

Weight

30 lbs empty (13.5Kg), 80 lbs (36 Kg) with solder

GW-10

Solder Fountain

GW-10A

Solder Fountain with blow-thru air nozzle

 Device Type

 Available Wave Nozzle Sizes

 Wave Nozzle #

 Air Nozzle #

 14-20 pin DIP

 1.00 x 0.50 in. (25 x 13 mm)

 WN-10

 AN-10

 24-28 pin DIP

1.50 x 0.75 in. (38 x 19 mm)

 WN-20

 AN-20

 30-48 pin DIP

 2.50 x 0.75 in. (64 x 19 mm)

 WN-30

 AN-30

 PGA

 1.00 x 1.00 in. (25 x 25 mm)

 WN-40

 AN-40

 PGA

 1.50 x 1.50 in. (38 x 38 mm)

 WN-50

 AN-50

 PGA

 2.00 x 2.00 in. (50 x 50 mm)

 WN-60

 AN-60

 Flat connectors

 2.75 x 0.35 in. (70 x 9 mm)

 WN-70

 AN-70

 Large connectors

 4.00 x 0.75 in. (102 x 19 mm)

 WN-80

 AN-80

 Custom available

 (5 in sq. max., e.g. 1.25" x 4")

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GW-10 Brochure.PDF | GW-10 Manuall | GW-10HTman.pdf

GW-10UBF Option.PDF: Universal Board Fixture