Manufacturer of low to medium volume surface mount assembly systems including: stencil printers, pick and place machines and reflow ovens.

The new LS pick & place has positional resolution of 2 microns, also see the new Complete Vision Centering option.

Product Range:

SMT Assembly Equipment:

Manual, semi-auto and automatic
stencil printers
Manual fluid dispensers
Manual pick & place and automatic
pick and place systems
Our lowest cost auto pick & place
Reflow ovens, inline* and batch*
Vapor Phase Reflow
Higher volume production reflow ovens*

Lead Forming Equipment:

Axial component lead formers
& trimmers
Radial component lead trimmers

Component Counters:

Taped axial, radial, and SMD
component counters

Soldering Products:

Dip solder machines and solder pots
Single and dual hot plates
Conduction / convection ovens
Solder reflow ovens
Solder fountain (mini-wave) for
thru-hole rework
Automatic selective soldering machines
Vapor Phase Reflow
Higher volume production reflow ovens*

The basic SMT manufacturing process can be simplified to the following steps: Paste, Place, and Reflow. To address this process, APS, in 1992, introduced its own line of manual stencil printers, manual pick & place machines and benchtop reflow ovens - the Gold-Series.
These systems quickly established APS as a leading SMT equipment provider. In fact, the Gold-Series SMT line, sold in over 48 countries, has become the standard for low volume surface mount assembly! APS continues to focus on the three-step manufacturing process for low to medium volume assembly. To answer our customers' needs, APS most recently introduced the affordable LS-series automated pick and place systems with high positioning resolution to 2 microns, as well as new-technology, patented* Horizontal Convection™ reflow ovens for use with lead free solder alloys. FOR MORE INFO SUBMIT THIS CONTACT FORM

*Patent 6,936,793

Phone: 215-938-1000; Fax: 215-938-8480

© Copyright 2008, APS NOVASTAR LLC, all rights reserved.