Glossary of Industry Terms

Here's a glossary of terminology used in the PCB assembly industry to give you some familiarity with the processes involved.

A - Acceptance Tests to Axial Leads

B - B-Stage Material to BUS

C - CAD to Curing

D - Daughter Board to Dynamic Ram (DRAM)

E - Edge Clearance to ESR

F - Fabrication to Functional Test

G - Gerber File to Ground Plane

H - HDI to Hole Density

I - Icicling to ISO

J - JEDEC to Junction

L - Laminar Flow to LPI

M - Magazine to Multilayer PCB

N - NC Drill to NPTH

O - Organic Solder Preservative (OSP) to Outgassing

P - Package to PTH (plated through-hole)

Q - Quadpack to Quench

R - Read Access Memory (RAM)

S - Scanning Electron Microscopy to Surface Mount Technology

T - Tape Automated Bonding to Turnkey

U - Ultra-Fine Pitch (UFP) to UV Curing

V - Vapor Phase Soldering to Voids

W - Wave Soldering to Wetting Agent

X - X-Ray Laminography

Y - Yield Loss

Z - Z

ref: Phil Zarrow & Debra Kopp, Surface Mount Technology Terms and Conditions, 1997