| CAD: Computer Aided Design. |
| CAM Files: Files provided for manufacturing PCB. |
| CAM: Computer Aided Manufacturing. |
| Capacitance: The property of a system of conductors and dielectrics that permits the storage of electricity when potential differences exist between the conductors. |
| Capacitors: Simple, non-semiconductor electrical components. |
| Castellation: A leadless termination used on LCCC packages for connection to a printed circuit board. |
| Catalyst: A compound that accelerates the cure of a resin without being altered in the reaction. |
| Ceramic Ball Grid Array (CBGA): A ball grid array package with a ceramic substrate. |
| Certification: Verification that specific defined tests have been performed and required parameters have been met. |
| Chip: An individual circuit or component. |
| Chip Scale Packaging: A way of packaging integrated circuits without using epoxy that takes up less board space. |
| Chip-On-Board (COB): The process of using a wire bond, solder or other conductive adhesives to attach chips onto printed circuit boards. |
| Circuit: The interconnection of multiple devices in one or more closed paths to perform a desired electrical or electronic function. |
| Circuit Density: Number of circuits on a given area of a printed circuit board. |
| Circuit Verifier: A device that electrically stimulates an item to be tested and monitors for the proper response. |
| Coating: A thin layer deposit on a substance surface. |
| Coefficient of Thermal Expansion (CTE): The ratio of dimensional change of an object from the original dimension when temperature changes. |
| Component: A part or combination of parts mounted together to perform a design function. |
| Component Side: The side of a printed circuit board which has the most mounted components. |
| Conduction: Heat transfer that occurs across solids due to temperature gradients. |
| Conductor: A conductive area on a printed circuit board or internal layer usually composed of path and lands to which component leads are connected. Also referred to as a trace. |
| Connector: A device that provides electrical connection between the printed circuit board and cables, racks, or chassis. |
| Constant: The measure of a material’s ability to store electric energy. |
| Contact Angle (Wetting Angle): The angle created on the contact surfaces when two objects are bonded together. |
| Continuity: A continuous path for flow of current in an electrical circuit. |
| Copper Foil (Base Copper Weight): Coated copper layer on the board measured by weight or thickness. |
| Curing Time: The time needed for an epoxy to fully cure at a given temperature. |
| Curing: The process of polymerizing a thermosetting epoxy. |
