Glossary Table M

 

Magazine: A portable enclosure used to hold PCBs or product.
Mask: The photographic negative that serves as the master for making thick and thin film screens.
Mean Time Between Failures (MTBF): The mean average time, usually in hours, that can be expected between failures an operating unit.
Melting Point: The temperature at which a solid becomes a liquid.
Mesh Size: The number of holes per linear measure in a screen printing material.
Micro Ball Grid Array: The process for placing an integrated circuit or other component on a multi-layer PCB using an array of extremely small solder balls (or columns) at each contact.
Microprocessors: Integrated circuits that contain the CPU for a computing device.
Microvias: Laser-created small holes, or vias.
Mil: Unit of length equal to 0.001 inch.
Mil. Std.: Military Standard, the basic military standard for reliability.
Minimum Conductor Width: The smallest distance between any two adjacent conductors, such as traces, in a PCB.
Mixed Assembly: An assembly composed of through-hole and surface mount components.
Motherboard: A printed circuit board for interconnecting arrays of plug-in electronic modules.
Multi-Chip Module Laminates: A PCB design for placing multiple integrated circuits or other components on a limited surface area.
Multilayer PCB: Circuit boards with three or more layers of printed circuits separated by laminate layers and bonded together with internal and external interconnections.
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