Vapor Phase Reflow

Vapor phase reflow offers the simplest and most reliable method of soldering with soldering occurring in the narrowest of process windows. The method is applicable with even the most complex SMT components like QFT, BGA, flip chips, and ceramic assemblies.

How it Works
The process relies on heating an inert, electrically non-conducting liquid to its boiling temperature creating a chemically inert vapor phase. The temperature of the vapor phase is identical to the boiling point of the liquid.

Soldering begins by bringing the board into contact with the vapor.  With the board at a lower temperature then the boiling temperature of the liquid, the vapor condenses on the surface of the board. The condensation process continues until the board reaches the temperature of the vapor. The solder past liquefies due to its melting temperature being below that of the vapor phase. The warming of the board with vapor provides a completely oxidation-free melting point. The boiling point of the liquid determines the soldering temperature.

The heat exchange medium typically recommended for vapor phase reflow is Galden®, a perfluorpolyether containing only carbon, fluorine, and oxygen atoms. The following characteristics of Galden make it an excellent choice for vapor phase reflow:

  • High temperature durability
  • Excellent material tolerance
  • Durability against reactive chemicals
  • Good dielectric attributes
  • Low steam pressure
  • High steam density
  • Excellent heat transfer coefficients
  • Low surface energy and good moistening qualities
  • Chemically inert


Advantages of vapor phase reflow:

  • Temperature profiling is unnecessary with vapor phase reflow. The vapor reflows the joints and the boiling point of the liquid defines temperature. Boards will only be heated as high as the condensing vapor temperature.
  • The process conditions are highly repeatable providing consistency from batch to batch with uniform temperature distribution across the board.
  • Easily switch from lead to lead-free soldering and eliminate board delamination.
  • Operating Costs are low with little maintenance required.
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