« Reflow Ovens - Low Volume
GF-B & GF-B-HT Reflow Ovens
Cost-effective batch reflow oven utilizing forced air convection heating technology with individual time and temperature controls makes profile set up quick and easy. The GF-B-HT is a high temperature model capable of lead-free soldering.
This unique shuffle system enables a higher throughput than standard batch ovens. Both sides of the oven have a cooling station. While one board is being processed, another board can be cooled and off-loaded, then a third board can be loaded and shuttled into the chamber for reflow.
- Large to window allows the operator to see the board throughout the entire reflow process
- Unique shuttle system enables higher throughput than standard batch ovens
- All stainless steel interior construction provides for years of useful life
- Nitrogen gas inerting option available
- Maximum board size is 12" x 12" (305mm x 305mm)
- Available in Lead and Lead-free versions
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| Max board width: | 12” x 12” (305mm x305mm) |
| Max board height: | 1.250” (32mm) |
| Heating zones: | One (1) |
| Max temperature: | GF-B: 250°C (482°F), GF-B-HT: 315°C (600°F) |
| Heat tunnel length: | NA |
| CyclonicsTM (forced air): | One (1) |
| Conveyor extensions: | Dual board shuttle |
| Cooling station(s) : | Two (2) |
| Venting: | 4” (102mm) flange with integral fan |
| Cooling Zone Venting: | N/A |
| Nitrogen option: | Yes |
| PC Interface: | No |
| Overall dimensions (L x W x H): | 38.13” x 28.13” x 14.5” (968mm x 715mm x 368mm) |