Lead Free Benchtop Reflow Ovens and Inline Reflow Ovens for the SMT Assembly Process

Gold-Flow Benchtop Reflow Ovens

Even though these benchtop ovens are small, the 3 vertical zones plus the cooling zone give remarkably accurate profiles for reflow applications. With the new patented Horizontal Convection™ technology*, the "-HT" models are fully compatible with Lead Free for RoHS compliant soldering. | Batch ovens | 4 & 6 zone ovens
Vapor Phase Reflow

For high volume ovens and wave solder machines: Novastar .

FOR MORE INFO SUBMIT THIS CONTACT FORM

GF-12HC Standard Features

Patented Horizontal Convection™* oven with 12" wide conveyor
GF-12HC* uses Horizontal Convection™ heating technology
GF-12HC-HT for lead free solder alloys - Max temp. 662° F (350° C)
39" long benchtop oven with 26" long heated tunnel, plus 6" long cooling zone
Stainless steel conveyor and chambers
3 vertical heating zones plus cooling zone
Easy lift clamshell design
Viewing windows with lighted interior
CE compliant
Computer controller with:

100 menu profile storage
7 day programmable timer
Real time graphic temperature profiler
ISO 9000 SPC fault monitoring and reporting
Battery memory backup
English or metric units
Password protection

Configurations

(See the larger benchtop models: GF - 120HC/HT*)

GF-12HC* includes 3 zones with Horizontal Convection™, cooling zone and conveyor extensions

Profiling kit option:Profiling Accessories Kit

Electrical Power:................220 VAC, 50/60 Hz, 1Ø, 5.5 kW
Max Board Width:............. 12" (305mm)
Heated Tunnel Length:....... 26" (610mm)
Overall Dimensions:.......... 39" x 32" x 19" (990 x 813 x 483mm)
Model GF-12HC maximum temperature........ 482°F (250°C)
Model GF-12HC-HT maximum temperature........ 662°F (350°C)

Download useful article on: How to Profile a PCB.pdf

GF-B Shuttle Batch Oven Features

See GF-B-HT oven profile
This unique shuttle system enables a higher
throughput than standard batch ovens. Both sides
of the oven have a cooling station, and while one
board is being processed, another board can be
cooled and offloaded, then a third board can be
loaded and shuttled into the chamber for reflow.

Lead Free Soldering capability (GF-B-HT model) Max. Temp. 315° C (600° F)
100% forced air convection
Individual time and temperature microprocessor controls make profile set-up easy
All stainless steel interior construction
Unique shuttle system enables higher throughputs than standard batch ovens
CE compliant
Dual cooling zones
Processes boards up to 12" x 12"
Large viewing window on top enables viewing of entire reflow process
N2 inerting option available (Model GF-BN)

Specifications

Configuration:................... 3 bottom heating elements (2 cyclonics)
Electrical Power:................ 20A @ 220 VAC, 50/60 Hz, 1Ø, 2.7 kW
Cooling Zones:................... 2
Max Board Width:............. 12" (305mm)
Venting:.............................. exhaust fan with 4" flange
Overall Dimensions:.......... 37" x 28 1/4" x 14 1/2" (940 x 715 x 368mm)

*Patent 6,936,793