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GW-BD-HT High Temperature Dip Solder Machine
High temperature, lead-free "Big Dipper" semi-automatic soldering system made easy with microprocessor control for consistent, high quality soldering.
- Articulated dipping movement prevents trapping of air bubbles
- Three (3) stage timed process includes flux cycle, preheat cycle and solder cycle
- Microprocessor control with LCD display
- Twelve (12) menu storage
- Flux station with flux drain
- Stainless steel solder pot
- Pallet with adjustable titanium fingers hold PCBs
- High temperature (350°C), lead-free model
- Available in Lead only version
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| Solder type: | Hi-temperature, Lead-free |
| Max solder temp: | 662°F (350°C) |
| Solder capacity: | Approximately 50 lbs (23Kg) |
| Blow-thru air nozzle: | N/A |
| Compressed Air Req'd: | N/A |
| Overall dimensions: | 31” x 25.25” x 24.5” (787 x 641 x 622 mm) |
| Board Size: | Eight (8) |